Epoxy Technology, Inc. was founded in 1966 as the world's first supplier of electrically conductive epoxies for use as die-attach adhesives in hybrid microelectronics, semiconductor packaging and assembly. Chemical engineer Frank W. Kulesza, our President, first formulated these precious-metal-filled materials as a consultant for IBM. Since then the growth of Epoxy Technology, Inc. has been fueled by the rising use of die-attach epoxies. But our expertise in manipulating epoxy compounds has also resulted in a continual broadening of our product line over the years.
In addition to our comprehensive family of materials for the semiconductor and hybrid fields, we now offer products suited for a wide array of applications in fiber optics, optoelectronics, medical devices, and solder replacement.
During recent years, our continuing commitment to develop innovative adhesive and coating technology for high-tech manufacturers has resulted in the patented polymer flip chip (PFC®) technology, as well as numerous new materials optimized for uses in the industries we serve.

Thermal Interface Materials (TIM) provide a thermally conductive, void-free bond for attaching heat sinks. These materials eliminate air gaps in heat sink attach which leads to improved thermal management properties. EPO-TEK® thermal interface materials are ideal for use in today’s high heat/high power applications including: photovoltaics, lasers and laser diodes, LED and high power RF amplifiers. These materials can also be used for heater attach applications in LCD and avionics.

Because interfaces and other geometry factors play such a large role in determining the actual thermal resistance of an adhesive in a device, a high bulk thermal conductivity value for an adhesive is important, but may not always be a sufficient predictor of low resistance. To achieve the most efficient thermal transfer in an actual device, low thermal resistance is required.

Epoxy Technology has developed a new highly Conductive silver-filled adhesive for high power applications. EPO-TEK EK1000 was designed to provide superior thermal performance for high reliability applications such Solar Concentrator IC's and Power Semiconductors.
EK1000 has a Thermal conductivity value ranging from 12.6 to 22.0 W/m°K depending on the cure schedule.

Another new highly conductive silver-filled adhesive designed for Thermal Management applications: EPO-TEK ED1003 provides superior thermal performance in applications such HB LED's and Power Semiconductors.
ED1003 has a Thermal conductivity value of 8.46 W/m°K along with high Tg of 160°C and long pot life (28 days).

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